典型的多层建筑板采用电源平面将提供这种热蔓延而不需要额外的专用铜领域的能力。
Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area.
研究对象包含了组成电源分配系统的电源模块，电源平面、接地平面、旁路电容和高速芯片的封装及内部电源分配等问题；
The research objects include power module, power plane, ground plane, bypass capacitor, encapsulation of high-speed chip and inside power distribution.
公司系列平面变压器已经在铝基板通信电源模块中大批量广泛应用。
Company planar transformer series aluminum plate has communication power module widely used in large quantities.
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