通过正交试验优选出一种用于印刷电路板的镀铑新工艺。
A new rhodium plating process applicable to printed circuit board was optimized by orthogonal test.
耐高纹波，小尺寸，105c, 2000小时，可用于印刷电路板中。
High ripple current, Smaller size, Load life of 2000hours at 105c, Used in PCB Mounting.
本发明涉及一总用于安装在印刷电路板上的半导体器件(1)。
The invention relates to a semiconductor component (1) for mounting on a printed circuit board.
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