采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
经过多年努力，工厂规模不断扩大，拥有先进的生产设备技术，使产品无论在设计、用材还是质量监控、售后服务等方面均追求一流水准。
Over the years, factories have been expanding, with advanced production equipment technologies to the design, use of materials and quality control, service aspects, such as the pursuit of class.
本综述介绍了近年来国内外提出的各种点焊质量监控方案及它们在实际生产中应用的可能性。
This literature review introduces recently Proposed and developed monitor or correction system abroad. Special emphasis has been put on the applicability in large quantity production.
应用推荐