铜粉及片状粉末。
结果表明：通过控制工艺参数可以获得镀覆质量好，且具有很好导电性和低松装密度的片状锡包铜粉产品。
The results indicate that good coating quality tin coated flake Cu powder with well electric conductivity and loose specific gravity can be obtained by controlling technological parameters.
介绍了导电漆、作为导电填料的片状镀银铜粉的制备工艺流程。
The preparation process flow of conducting paint and silver plated flake copper powder as conducting filling were introduced.
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