温度越高及焊锡表面的搅流越大，形成的浮渣越多。
The higher the temperature is, the bigger the stirring flow of the solder surface is, the more the scum there will be.
统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
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