第三焊线电性连接于第二芯片与承载器之间。
The third bonding wire is electrically connected between the second chip and the loader.
第二焊线电性连接于中继线路基板与承载器之间。
The second bonding wire is electrically connected between the relay circuit base board and the loader.
第一焊线电性连接第一芯片与中继线路基板之间。
The first bonding wire is electrically connected between the first chip and the relay circuit base board.
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