在叠层的组装工艺中，比如基板- 焊片- 芯片，即使有部分表面被盖住了，这种气氛同样有效。
This is also preformed on covered surfaces a stacked assembly : substrate - pre - form - die.
介绍了焊片零件拉伸、冲裁多工位级进模，分析了零件的冲压工艺性，并对模具结构进行了合理的设计。
It introduced drawing, punching progressive dies for solder pieces and analyzed the processing ability of the component for stamping and punching. The structure of the die was designed reasonably.
通过对插座连接焊片结构特点的分析，确定该冲压件的排样方案，设计了一副级进模。介绍了主要工作零件及模具总装结构设计。
Through analysis of structure of the socket weld connection pieces, determined the layout project, designed a progressive die. Introduced the design points of main parts and die structure.
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