本发明提供一种焊接构造。该焊接构造包括一基板、一焊接对 象、多个焊块和一支撑结构。
The invention provides a welding structure which comprises a substrate, a welding object, a plurality of welding blocks and a supporting structure.
结果之一是，这种激光必须先被分开构造，然后桥接到芯片上，这可比直接焊接在芯片上难得多，而且杀时间。
As a consequence, the lasers have to be constructed separately and then grafted onto the chips, which is more expensive and time-consuming than building them directly on silicon would be.
依据工程的详细状况也可以采取主管上直接焊接支管的构造，但必需校核支不锈钢管衔接处能否需求补强。
According to the specific circumstances of the project can also take charge of construction directly welded pipe, but must check a stainless steel tube joint can demand reinforcement.
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