通过对静电封接结构的受力分析,建立了静电封接后弹性膜片的热失配应力数学模型。
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
试验和测试了焊接热对栓接的影响。
采用热引发熔融接技方法研究了不同反应条件下马来酸酐(MAH)接枝hdpe、接枝共聚pp及接技EPDM弹性体的接枝反应。
The graft reaction of MAH grafted HDPE, PP and EPDM at various conditions is studied by means of polyolefin grafted MAH in melt via heat initiation.
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