压应力主要来源于晶格失配和热失配。
This compressive stress is derived from the lattice and thermal mismatch.
热应力主要是在制造过程中由于环境温度变化和封装材料热失配而产生的。
The stresses are formed in the manufacturing process because of the change of temperatures and the thermal mismatch between different materials.
通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
应用推荐