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提出了一种新型热感功耗模型，该模型能够准确估计出电压调整情况下的功耗和温度。
We propose a novel thermal-conscious power model for integrated circuits that can accurately predict power and temperature under voltage scaling.
较深的IGBT选型及功耗计算知识，功率模块热模型创建。
Deep IGBT selection and power loss calculation, power module thermal model knowledge.
研究了非制冷热成像系统功耗产生的主要原因，提出了一种具有低功耗特点的多工作温度热成像系统。
The reasons why thermal imaging system consumes power were analyzed, and a design scheme of lower power consumption thermal imaging system operating at multiple temperatures was presented.
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