封装结构的模态频率随着灌封胶弹性模量的增大而增大。
The modal frequency of the packaging structure increases with the elastic modulus of potting material.
你的邮件把我的信箱都灌爆了，我连一封象样的信都收不到。
Your mail overfills my mailbox, so I can't get any decent email.
电子工业用加成型液体硅橡胶灌封料的关键技术指标为：胶料黏度、硫化胶力学性能和电性能。
The key properties of additional liquid silicone potting material in electronic industry are viscosity, mechanical property and dielectric property.
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