...关键词:刚挠结合板;非对称结构;激光直接成像;覆盖膜; [gap=399]Keywords: Rigid-Flex PCB, non-symmetrical structure, LDI(Laser Direct Imaging),Coverlay.
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但是采用激光直接成像(Laser Direct Imaging,LDI)及激光刻板(Laser Structuring,Lg)技术来生产时,这种尺寸的在制板则属常规工艺范畴...
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提升PCB性能的激光直接成像技术 关键词 激光直接成像;PCB制造;电路装配 [gap=418]Key words LDI;PCB production;circuits assembly
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这种树脂能满足可见激光直接成像法生产印刷线路版的要求,也可用于紫外曝光成像体系。
The photoresist shows sufficient photo-sensitivity for making printed circuit board by laser direct imaging method and can be used also in u...
许多己经颁布的“标准”设计规范可能会随着电路板功能的增加而发生改变,通过激光直接成像(LDI)技术可以使得处于高端的PC B组件的成本降低。
Many "standard" design rules for registration can be changed to increase board functionality, and costs of high -end PCBs could be decreased through laser direct imaging (LDI).
通过双远心成像光路,激光直写(LDW)系统SVG-LDW 04把液晶空间光调制器(LCD-SLM)上的光斑直接成像在光刻胶板上,得到高质量的光斑图形。
The laser direct writing(LDW) system SVGLDW 04 with a projection optical system and a spatial light modulator(LCD-SLM) can expose a reduction pattern directly on a photoresist plate.
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