仿真分析在设计中发挥了重要的指导性作用——它优化了激光器接口电路的布线，确定了去耦电容的位置分布和大小选择。
Simulation plays an important role in the design, which optimizes the circuit design of laser interface and confirms the location and value of decouple capacitors.
采用激光微细熔覆直写布线的方法在陶瓷基板上制备高密度厚膜导体。
Thick film conductor was prepared on ceramic substrate by laser micro-cladding.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
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