为避免出现浸析问题，诸如波焊设备焊锡槽终饰工艺的修改目前已经完成。
Process modifications such as solder pot finishes for wave soldering equipment to avoid leaching issues are now available.
适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。
Apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
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