...关键字: CuNiSnTi；立方氮化硼；活性钎料；真空钎焊[gap=1628]Key words: CuNiSnTi; cubic boron nitride; active filler metal; vacuum brazing...
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采用银基活性钎料(Ag-Cu-Ti)对二维层间增强型和三维正交增强型C/C复合材料进行了真空钎焊工艺试验,采用扫描电镜(SEM)观察了钎焊接头和连接界面的微观组织形貌...
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... Filler metal selection 选择填充金属 active brazing filler metal 活性钎料 filler metal diameter 填充金属直径 ...
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本发明钎料的制备方法如下：将活性钎料原材料加入到行星式球磨机中进行球磨。
The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling.
与传统的活性金属钎焊不同，它采用的是一种高温下形成液相的氧化物-金属钎料，并且钎焊过程不需要真空或惰性气氛保护。
Different from the traditional active metal brazing, RAB uses a liquid-phase oxide-metal melt at high temperature and the process does not require a vacuum or inert atmosphere.
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