无铅波峰焊接制程的坚强后盾。
电子组装的高密度给传统波峰焊接技术提出了新挑战。
The high density of electronics assembly has already bring up the new challenge to conventional wave soldering technology.
桥连现象是波峰焊接过程中最常见的一种焊接缺陷，其影响因素是多方面的。
Bridge phenomenon is a frequent defect in wave soldering, which have many affected factors.
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