介绍了复合电镀的共沉积机理。
The codeposition mechanisms of composite electroplating were introduced.
以电化学的理论对液相沉积机理进行初步探索。
Mechanism of liquid-deposition is suggested in light of electro-chemistry.
介绍了最新的铁氧体磁性薄膜的化学镀技术、 沉积机理及其应用。
The latest developed electroless spinel ferrite films plating technology is introduced. The mechanism of deposition is discussed in detail, and applications are illustrated.
应用推荐