欠电位沉积（Underpotential Deposition，缩写UPD）是指一种金属可在比其热力学可逆电位正的电位下沉积在另一基体上的现象，是一个与电极/溶液结构密切相关的重要的电化学现象
研究了冷压银衬底上铋和碲的欠电位沉积薄层电化学行为。
Thin-layer electrochemical studies of the underpotential deposition(UPD) of Bi and Te on cold rolled silver substrate have been performed.
本研究报道了界面带电、浓度效应、阴离子共吸附对铜在金（ 100 ）表面的欠电位沉积层的稳定性所造成的影响。
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.
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