对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
论述了浮选槽的结构特征以及浮选槽中浆流速度、湍流强度和流动方向等特征对浮选脱墨流体动力学的影响。
The effects of flow velocity, turbulence level and flow direction in the cell on hydrodynamics of flotation deinking were also discussed in this paper.
介绍了沉降槽的设计条件，计算了酸不溶物的沉降速度和沉降面积，总结了改造效果。
Design conditions of settling tank were introduced, settling speed and settling area for acid insoluble were calculated, and the reformation effect was summarized.
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