覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
一种显示模块,其主要包括显示面板、印刷电路板以及软性构装单元。
A display module mainly comprises a display panel, a printed circuit board and a flexible construction unit.
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