覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
此显示模块及其软性构装单元可提供良好的静电防护效果。
The display module and flexible construction unit thereof brings good static protecting effect.
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