进行了系统板级支持包BSP的开发。
The development of Board Support Package (BSP) is carried out.
对系统板级支持包bsp进行了深入的研究，分析和总结了BSP的文件结构。
Board Support Package (BSP) is lucubrated and the file structure of BSP is analyzed and summarized.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
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