通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
基于Sigrity开发的电磁分析方面的专利技术，其软件工具提供快速和先进的可用于整块电路板和芯片封装的电源及信号完整性分析。
Based on proprietary and patented technologies, SIGRITY offers industry's unprecedented fast and advanced software tools capable for power and signal integrity analysis of entire PCBs and IC packages.
太阳能电池板的制造方法和电脑芯片如出一辙，都需要历经污染严重的能源密集型加工过程。
Solar panels are manufactured very similar to computer chips which are dirty and energy-intensive processes.
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