电气绝缘用树脂基反应性化合物。第3部分：单项材料规范。第3活页：未加填料的聚氨酯化合物。
Resin based reactive compounds used for electrical insulation - Part 3 : specifications for individual materials - Sheet 3 : unfilled polyurethane compounds.
当反应器未加填料时MLSS值稳定，加入填料后附着其上的微生物不断生长、增殖，悬浮生物由于食料竟争而被抑制，致使MLSS值降低，缓解了膜组件的污染；
Microbes attaching on the carriers fleetly develop and proliferate, it effectively reduces suspended-growth microbes or MLSS for food competition and also depresses fouling of membranes;
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