... 零切割晶体 cutcrystal 晶体切割 crystal cut ; crystal cutting ; X 晶体切割器 crystal cutter ...
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晶体切割机 crystal cutting machine ; crystal edging machine ; cutting machine ; crystal
晶体切割器 crystal cutter
石英晶体切割机 quartz crystal cutter
切割晶体 at cut crystal at ; [晶体] sliced crystal ; Y-cutcrystalY
零切割晶体 zero-cut crystal ; zero-error reference
晶体割切 crystal cut
晶状体玻璃体切割术 lens-vitrectomy
X切割晶体 X-cut crystal
半导体晶圆切割代工 Wafer Dicing
本发明涉及解决在离子植入系统中的晶体切割误差数据，由此易于更准确的离子植入。
The present invention is directed to accounting for crystal cut error data in ion implantation systems, thereby facilitating more accurate ion implantation.
我们认为，近完整晶体的切割损伤层是由多晶层、嵌镶结构层和畸变层组成。
We consider that damage layers on near perfect crystal consist of polycrystal layer, Mosaic structure layer and distorted layer.
在大尺寸半导体基片和功能晶体的切割中。固结磨料线锯以无可比拟的优点被认为是最好的切割方法之一。
Fixed abrasive wire saw is recognized as one of the best methods in cutting large size semiconductor chip and function crystal because of its incomparable advantages.
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