实验表明：系统的密封质量对能否实现无氧化加热至关重要。
It is proved by the experiments that the quality of air-proof of the device is very important for realizing the non-oxidation healing.
高效少无氧化加热技术及热塑性成形过程中防氧化技术的研究，是实现精成形的关键配套技术。
High effective heating technology without or little oxidation and prevention oxidation during thermo-plastic forming are key kit technology to realize precision forming.
在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
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