多层板的话还有若干个中间层（Mid） 内部电源/接地层(Internal Planes)：内部电源/接地层主要用于4层以上印制电路板作为电源和接地专用布线层。 阻焊层(Solder Mask)：绿油覆盖层。
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所有的屏蔽都应该连接到相应的接地层。
All shields should be connected to an appropriate ground plane.
采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。
In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.
共振频率可以改变被动的加载与调谐组件，它可与天线单元和接地层放置天线。
Resonant frequency can be changed by loading the antenna with a reactive tuning component, which can be placed between the antenna element and the ground plane.
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