安装结构的另一面被安装到基板，该基板也具有接合焊盘。

The other side of the mounting structure is mounted to the substrate, which also has bond pads.

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第一管芯，其包括管芯表面和位于所述管芯表面上的管芯接合焊盘；

The die comprises a plurality of die joining bonding pads on the surface of the die.

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钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。

Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).

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