本文采用投影散斑相关法对芯片翘曲度进行了测量。
The speckle projection correlation technique is used to measure the chip warpage.
其次分析了影响其测量精度的几个主要因素，即散斑噪声、接收器件本身的分辨率、投影片光束的宽度与稳定性。
Three factors, laser speckle, CCD resolution and the width and stability of sheet beam, which influent and limit the precision of measurement, are discussed.
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