本实用新型所述双抓手抓料装 置解决了现有分选编带机的抓料装置存在的生产效率低的缺点。
The double-grip-hand material-gripping device solves the defect that the prior material gripping device of a separation taping machine has low production efficiency.
现有的晶圆传送装置，当晶圆叉子倾斜时无法将其调水平，造成晶圆抓手撞到晶圆引起破片的现象。
The prior wafer transmission device fails to adjust a wafer fork horizontal when the wafer fork is inclined, which results in breakage when the wafer handle collides the wafer.
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