有机气凝胶中存在的扩散界面层在其裂解过程中消失，这可能是由于在裂解过程中扩散界面层向粒子迁移以降低界面能所致。
After pyrolysis, the polydispersion is retained in the carbon aerogel, however, the diffuse interface layer disappears due to migration of the layer to particles to reduce the interface energy.
实验得到了铜在常温下的调制频率与相位差间的实验数据，通过对实验数据的线性拟合得到了铜的热扩散系数，以及铜-不锈钢在300 K和20 K低温下的接触界面层热阻。
The experimental data of copper was obtained about the phase lag dependence of modulation frequency at normal temperature, and the thermal diffusivity of copper was acquired by using the linear fit.
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