自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
本文介绍一自动计数和数据处理的微型计算机装置，它是由半导体探测器、电荷灵敏放大器、成形电路和一微型计算机组成。
A device for automatic counting and data reduction is introduced. This device consists of a semiconductor detector, a charge sensitive amplifier, a pulse shaping circuit and a microcomputer.
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