需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。
The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.
还需要为恢复小型灌溉设施、市场道路和农产品加工及储存设施，提供技术和后勤支持及器材。
Technical and logistical support and materials for the rehabilitation of small irrigation schemes, market roads, and agro-processing and storage facilities are also needed.
性能无忧：拥有断点续雕、断电恢复、加工时间预测等功能，真正人性化设计。
Excellent Performance: breakpoint carving, power failure recovery, processing time and other functions, the real humanized design.
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