介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
通过试验，相对于原先没有用于冷却气体流通用的通孔的护板，该改进可以把微晶含量减少到31.8%。
Through experiments, the improvement can reduce the content of minicrystal to 31.8 percent, compared with an original protective plate without a through hole for the cooled air to circulate.
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