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为板级封装动态响应分析和焊料微互连应力分析提供了基础。
The reliability of solder interconnections is dependable on the dynamic response of the board-level package.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
研究表明单独的冲击载荷和顺序载荷下焊料微互连的失效机理是不同的。
The failure mechanism of solder interconnections under sequential TC and drop impact test is different from that under single drop impact test.
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