·2,447,543篇论文数据，部分数据来源于NoteExpress
论文介绍了互连参数的内容、受集成电路工艺变异的影响及定性方法；
The thesis introduced the interconnect parameters and the influence of process variations and the charactering method.
论文分析了当前的研究状况，介绍了集成电路工艺变异的内容及对集成电路器件、互连以及电路性能的影响。
This thesis analyzed the current researching situation, introduced process variations and the influence to IC devices, interconnect and circuits.
工艺参数的变异导致半导体制造过程的偏差。
The process variation accounts for deviations in the semiconductor fabrication process.
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