This paper describes formation of embedded passive component(R,C,L) using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成嵌入无源元件(RCL)。
参考来源 - 可印刷电子技术(4)·2,447,543篇论文数据，部分数据来源于NoteExpress
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes general situation of printable electronics, high function thick film printing technology and it's application.
嵌入式无源元件技术能够实现对电容、电感等无源元件在印刷线路板内部的嵌入式封装，从而节省线路板表面空间、提高封装密度。
The embedded passive technology can save the real estate on the surface of the printed-circuits-boards (PCBs) by embedding the capacitors and inductors inside the PCBs.
应用推荐