也介绍了测温传感器结构小型化方面所做的工作。
The miniaturization of current temperature sensor is also dicus-sed.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
此方法还省去了偏振片，促进了SPR传感器的小型化、集成化。
This method reduces the polarizer and promotes the miniaturization, integration of SPR sensor.
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