导电衬垫又称EMI衬垫,常填充于电子设备机箱缝隙处,能够保持缝隙处的导电连续性,减小孔洞、缝隙、沟槽处的接触电阻,从而降低接合处两端的电压,减小缝隙的电磁泄漏。导电衬垫材料主要分为以下几类:导电橡胶、金属丝网、金属弹性衬垫、导电布等。
导电衬垫材料在抑制电子设备缝隙电磁泄漏中发挥了重要作用,是目前电子设备中应用最为广泛的一类屏蔽材料。
Conductive gasket material is one of the most widely used shielding materials at present, and plays an important role on the suppression of electromagnetic slot -leakage in electronic equipment.
该产品是在橡胶海绵或橡胶泡沫的周围裹着一层高导电性和耐磨性的导电纤维布,以形成一种屏蔽作用的衬垫介质。
The product is in rubber sponge or rubber foam wrapped around the high conductivity and wear resistance of conductive fiber cloth, forming a shield effect of liner medium.
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