电容器端部喷金层与膜上金属蒸镀层的不完全连接性，是电容器损坏的主要原因之一。
The incomplete connection between the spray end of metallized capacitor and metal layer of polymer film is the main cause of capacitor damage and failure.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
不锈钢靶容器的内表面薄薄地镀一层铀，镀层应牢固而均匀。
Preferable vessel is comprised of stainless steel, having a thin, continuous, uniform layer of 235u integrally bonded to its inner walls.
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