随着封装密度的进一步提高，其热失效问题也变得更加严重。

Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.

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研究了低功率密度激光辐照结构的热动力失效。

The thermodynamic failure of the structures irradiated by laser beam with low power density are studied in this paper.

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作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。

Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.

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