金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
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