... multilayer metallization 多层金属化 multilayer mirror 多层镜 multilayer package 多层外壳 ...
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... 扭绞多心电缆 multiple-twin cable 多层外壳 multiple-walled envelope 多绕组变压器 multiple-winding transformer ...
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高能物理专业英语翻译E-56-SCIdict学术词... ... 玻璃泡 envelope， glass 多层外壳 envelope， multiple-walled 反应堆包封 envelope， pile ...
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多层陶瓷外壳 multilayer ceramic package
本文叙述了多层陶瓷外壳的基本工艺和设计，主要原材料的选用以及在科研和生产过程中的一些问题。
This article describes essential process and design of multiplayer ceramic packages, selecting of major original materials, and its some questions in the research, and production.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
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