通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
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