... doubling of frequency 倍频 doubling plate 复板，加强板 doubling register 倍增寄存器 ...
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这些特征保证了复板和基板之间的快速优质冶金结合。
All the above ensure quick and high quality metallurgical bonding between flyer plate and base plate.
该方法为彻底解决复板和其它类型容器应力腐蚀开裂提供了新途径。
The process gives a way to solve SCC for cladding plates and other structures.
复板焊接结构出现应力腐蚀开裂的主要原因之一是拉伸残余应力的作用。
One of main reason for producing SCC in cladding plate weldments is the role of tensile residual stresses.
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