这些品质卓越的传感器应用在心脏监测和生物仪器电极，具有非剥落涂层并均匀地分布模压塑料基板上。
These superior quality Sensors which are used in Heart Monitoring and Bioinstrumentation Electrodes feature a non flaking coating that is uniformly distributed over the molded plastic substrate.
表面微加工工艺采用两种晶体硅芯片基板作为赖以建立层的基础，或者可以在更便宜的玻璃或塑料基板启动。
The surface micromachining process uses either crystal silicon chip substrates as a foundation upon which to build layers, or can be started on cheaper glass or plastic substrates.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
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