文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
In this paper, the merits and demerits, the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
改变了风格层堆叠的方式改变为核心，预浸料层是通过分布层堆叠。
Changing the layer stack-up style changes the way that the core and prepreg layers are distributed through the layer stack.
相同的持续效应不能堆叠，相同效应产生的加值或减值也不能堆叠。
No ongoing effect stacks with itself, nor does a bonus or penalty provided by the same effect.
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