研究结果表明，随着靶基距的增加，膜厚均匀性逐渐变好。
The results showed that the thickness uniformity becomes better along with the increasing target-substrate distance.
采用计算机计算了基片处于不同靶-基距时，膜厚均匀性的分布。
Based on it, some expressions of thickness uniformity were discussed, with the distribution of thickness uniformity calculated at different target-substrate distances.
并发现了靶基距、功率和溅射气压对薄膜矫顽力的影响较大，其中靶基距是薄膜矫顽力最主要的控制因素。 而溅射时间在所取的水平上对薄膜矫顽力的影响最小。
The target-substrate distance, the DC power and the sputtering pressure are very important factors for coercivity, on the other hand, the effect of sputtering time is not obvious.
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