...集成在一个大圆片上， 从而又导致了封装由单个小芯片级转向硅圆片级 从而又导致了封装由单个小芯片级转向硅圆片级 (wafer level) (wafer level)封装的变革，由此引出系统级芯片 封装的变革，由此引出系统级芯片 SOC (System on Chip) SOC (System on Chip)和电...
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圆片级封装 WLP ; wafer level package ; MCP
晶圆片级芯片规模封装 WLCSP
圆片级可靠性 wafer level reliability ; WLR
圆片级规模集成 wafer scale integration
晶圆片级芯片范围封装 WLCSP
圆片级堆叠工艺 wafer-level stack process ; WSP
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文章论述了超csptm圆片级封装技术工艺。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
它们可以分为圆片级封装、芯片级封装、和封装面。
They can be classified into wafer level, chip level, and package level stacking.
介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。
This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.
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