以下几个层次:即裸片级封装(Die Level),器件级封装(Device Level),硅圆片级封 装(Wafer Lever Packaging),单芯片封装(Single Chip Packaging)和系统级封装(System
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该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
随着器件功能的日益复杂和封装的多样化，实现器件级的鉴定越来越困难。
Due to the complicity of the component's functions and the variety of device's packaging, the component level testing is getting more and more difficult.
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